KSW Microtec, Dresden, Germany, will show its latest products for the contactless card industry at Cartes&ID from November 17 to 19, 2009. Among the displayed KSW products will be the new generation of thinnest RFID prelaminates for eGovernment, ePayment and High Security applications, which eID cards require to enable the implementation of a variety of additionally needed card layers for security features and not to exceed the allowed card thickness.
The prelaminates of the Thinlam® family are extremely thin and enable the manufacturing of HF and UHF RFID cards with multiple layers, due to the thickness down to 200µm. As the Thinlams® are manufactured without chip modules, they ensure an exceptionally plane card surface without sink marks. Furthermore, the prelaminates maintain the highest durability thanks to the patented chip connection technology, achieving tighter resonance frequency tolerances. Thinlam® is available in polycarbonate, PVC, PET or Teslin® and can also be used for transparent RFID cards due to the excellent optical appearance.
An ideal security and tracking solution is offered by the KSW WindSpeed® family. KSWs windshield inlays, with a read range of approximately 18 feet, offer more accurate, efficient and secure vehicle access for commercial fleet operators as well as for private vehicle owners who require secure access and safer parking.
The inlays also allow safe access to parking areas, secured business and industrial parks as well as gated communities. The WindSpeed® family can also be used for toll stations and to control entry and exit gates to automotive services such as car rental parks or car washes.
Also, Henrik Warmbier, KSW Microtec product manager, will present on the topic of “Mobile Phone Sticker- A Bridge to NFC?” at the Cartes conference on November 19th.
Lift & Access is part of the Catalyst Communications Network publication family.
